Qualcomm’s Elite Sound Chip: The Wi-Fi Earbud Dream?
▼ Summary
– Qualcomm has introduced the Snapdragon Sound Elite Gen 2, a new chip that integrates micro-power Wi-Fi 6E directly into the main processor.
– This integration eliminates the need for separate Wi-Fi chips, addressing previous adoption barriers faced by device manufacturers.
– The new chip is 30 percent smaller and consumes up to 40 percent less power while offering twice the AI processing capabilities of its predecessor.
– Previously, Qualcomm’s S7 Pro platform required two chips for Wi-Fi functionality, resulting in limited market success with only one notable product release.
– Qualcomm is currently collaborating with HP, Bose, and Cleer to develop new products, including intelligent hearables with built-in cameras.
Qualcomm’s new Snapdragon Sound Elite Gen 2 chip integrates micro-power Wi-Fi 6E directly into the processor, aiming to solve the hardware constraints that have previously hindered high-fidelity wireless audio. This architectural shift allows earbuds and audio glasses to connect straight to home networks, enabling streaming of lossless audio without the signal drops often associated with Bluetooth limitations when devices are far from the source phone.
The technology follows a similar promise made in 2023 with the S7 Pro sound platform and its Expanded Personal Area Network (XPAN) tech. That iteration claimed to deliver 24-bit 96kHz lossless audio, a data density that exceeds Bluetooth’s bandwidth capacity. However, the previous solution required two separate chips to function, creating a form factor challenge for manufacturers of compact wearable devices. Consequently, adoption was minimal, with only Xiaomi releasing the Buds 5 Pro in 2025, which never reached global markets.
By consolidating Wi-Fi capabilities into the main silicon, Qualcomm has addressed these physical and power hurdles. The new Elite chip is reported to be 30 percent smaller than its predecessor while consuming up to 40 percent less power. Additionally, it offers twice the AI processing capabilities, making it a more viable option for device makers seeking to balance performance with battery life and size.
Industry partners are already exploring this new capability. Qualcomm confirms it is collaborating with HP on an unnamed product and working closely with Bose. Furthermore, the company is partnering with Cleer to develop what it describes as “a new category of intelligent hearables,” specifically pointing toward earbuds equipped with built-in cameras.
(Source: The Verge)
