Topic: near-memory compute

TSMC's HBM4 Revolution: 3nm Dies to Triple Performance by 2027

HBM4 and HBM4E will dramatically transform high-bandwidth memory, promising to triple performance by 2027 through a 2048-bit interface and the use of advanced 3nm-class logic dies to meet AI and HPC demands. A key innovation is the shift to logic-process base dies, produced by partners like TSMC,...