AMD Zen 7 “Grimlock” CPUs to Use TSMC 1.4nm, FOPLP Packaging by 2028
▼ Summary
– AMD’s Zen 7 “Grimlock” CPUs are rumored to use TSMC’s 1.4nm (A14) process technology, with trial production expected by 2027 and mass production in 2028.
– AMD CEO Lisa Su visited Powertech in Taiwan, indicating AMD may use Powertech’s FOPLP (Fan-Out Panel-Level Packaging) for advanced packaging.
– Zen 7 CCDs will incorporate next-generation 3D V-Cache technology, with up to 16 cores and 224 MB of L3 cache on a single CCD.
– For servers, Zen 7 will feature updated MATRIX engine capabilities and expanded AI data format support.
– The article notes that the ongoing AI demand will keep the CPU market highly competitive, with AMD focusing on data center segments.
AMD is already laying the groundwork for its next-generation CPU architecture, the Zen 7 “Grimlock”, which is expected to leverage TSMC’s advanced 1.4nm (A14) process technology and introduce new packaging innovations. This forward-looking move comes even as the Zen 6 architecture has yet to fully launch across server and consumer markets, with mass production on TSMC’s 2nm node already underway.
According to a report from Taiwanese Commercial Times, AMD has initiated supply chain preparations for the Zen 7 platform, codenamed “Grimlock.” These next-gen x86 processors will reportedly be built on TSMC’s A14 process, a 1.4nm-class design set to compete directly with Intel’s 14A node. The timeline points to a 2028 launch, aligning with TSMC’s own production roadmap for the A14 technology.
The report also reveals that AMD CEO Dr. Lisa Su recently visited Powertech during a trip to Taiwan, meeting with key supply chain and industry partners. This visit is believed to be tied to securing capacity for advanced packaging solutions, specifically Powertech’s Fan-Out Panel-Level Packaging (FOPLP). AMD is expected to integrate this technology into the Zen 7 platform to enhance performance and efficiency.
Supply chain sources indicate that the Zen 7 core chiplet (CCD) will not only utilize the A14 process but also incorporate next-generation 3D V-Cache technology. The company is actively evaluating Powertech’s FOPLP solution as part of its packaging strategy. TSMC’s Dachung Fab 25 P1 plant is slated to begin trial production of the A14 node by 2027, with mass production ramping up in 2028. This timeline is critical as Intel has recently gained momentum in its foundry business, securing major customers like Apple and TeraFab for its 18A-P and 14A nodes.
On the architectural front, the Zen 7 “Grimlock” CPUs are expected to feature a redesigned CCD with up to 16 cores and a massive 224 MB of L3 cache on a single 3D V-Cache CCD. This indicates a significant boost in both standard L3 cache and 3D V-Cache capacities compared to current generations. For server applications, the Zen 7 core will bring updated MATRIX engine capabilities and expanded support for AI data formats, catering to the growing demands of data center workloads.
While these advancements are promising, the broader context is the ongoing AI hyper-cycle, which shows no signs of slowing down. CPUs remain in high demand from AI firms, and AMD is doubling down on the data center segment, mirroring the strategies of its rivals. The competition among the “big three” chipmakers for a share of the $200 billion CPU total addressable market (TAM) is expected to intensify in the years ahead.
(Source: Wccftech)
