Qualcomm Copies Samsung’s Exynos Heat Path For Snapdragon 8 Elite Gen 6 Pro, But Botches It
▼ Summary
– Qualcomm is copying Samsung’s Exynos 2600 Heat Path Block (HPB) thermal technology for its Snapdragon 8 Elite Gen 6 Pro chip, but the implementation is less effective.
– The Exynos 2600’s HPB is a copper-based heat sink that remains in direct contact with the application processor (AP) to manage heat.
– The upcoming Exynos 2700 will introduce a new thermal solution called Side-by-Side (SbS), stacking AP and DRAM dies horizontally with a copper HPB on top.
– Qualcomm has prepared two versions of the Snapdragon 8 Elite Gen 6 Pro chip for the Samsung Galaxy S27 series, not six as previously reported.
– The non-binned Snapdragon 8 Elite Gen 6 Pro costs over $300, limiting its use to premium phones like the Galaxy S27 Ultra.
Imitation may be the sincerest form of flattery, but when it comes to thermal management in flagship mobile chips, copying the leader doesn’t always guarantee success. Samsung earned widespread praise for the Exynos 2600 and its innovative Heat Path Block (HPB) technology, a clever thermal solution designed to keep overheating under control. Now, Qualcomm , whose recent Snapdragon generations have gained a reputation for running hot , is reportedly borrowing that same concept for its upcoming Snapdragon 8 Elite Gen 6 Pro. The catch? The copy falls short.
According to tipster Reptalica, Qualcomm has prepared just two versions of the Snapdragon 8 Elite Gen 6 Pro for the anticipated Samsung Galaxy S27 series, not six as previously speculated. More importantly, the leaker reveals that Qualcomm’s flagship chip includes a variation of Samsung’s HPB thermal tech, but the implementation “isn’t as effective” as the original Exynos design.
For context, the Exynos 2600 uses a copper-based heat sink , the Heat Path Block , that sits in direct contact with the application processor (AP). This design allows heat to be channeled away more efficiently. Looking ahead, the upcoming Exynos 2700 is expected to introduce an even more advanced thermal architecture called Side-by-Side (SbS). In this setup, the AP and DRAM dies are placed horizontally next to each other, with the copper HPB heat sink layered on top for improved thermal dissipation.
Meanwhile, Qualcomm’s thermal strategy appears to be a rougher imitation. The tipster’s comments suggest that while Qualcomm acknowledges the value of Samsung’s approach, its execution leaves room for improvement , a notable weakness given the heat issues that have plagued recent Snapdragon chips.
Pricing adds another layer of complexity. Earlier estimates indicate that the standard, non-binned version of the Snapdragon 8 Elite Gen 6 Pro could cost upwards of $300. That steep price point means only the most premium devices , likely the Galaxy S27 Ultra , will feature the full-fat chip. Other models in the series may opt for the vanilla Snapdragon 8 Elite Gen 6 or a binned variant, making thermal performance a key differentiator across the lineup.
As Qualcomm races to match Samsung’s thermal ingenuity, the question remains: can a borrowed solution ever truly outperform the original?
(Source: Wccftech)
