AT&S invests €2bn in Malaysia and China to ride AI chip boom
▼ Summary
– AT&S will invest between €1.5bn and €2bn to expand capacity for high-end IC substrates used in AI and high-performance computing chips.
– The expansion will take place at the company’s plant in Kulim, Malaysia, and its facility in Chongqing, China.
AT&S, the Austrian manufacturer of printed circuit boards and chip substrates, has announced plans to invest between €1.5bn and €2bn to significantly expand its production capacity for high-end IC substrates. These advanced components are essential for building AI and high-performance computing chips, which are currently experiencing surging global demand. The investment will target two key facilities: the company’s plant in Kulim, Malaysia, and its site in Chongqing, China.
The strategic expansion aims to position AT&S at the forefront of the semiconductor supply chain as the AI boom accelerates. By boosting output of these specialized substrates, the company intends to meet the escalating needs of chipmakers who rely on them for next-generation processors. The move underscores a broader industry trend where manufacturers are racing to scale up infrastructure to support the relentless growth of artificial intelligence technologies.
(Source: The Next Web)
