Google’s Next Pixel May Use MediaTek Modem in Tensor G6 Chip
▼ Summary
– Google is testing the MediaTek M90 modem for the Pixel 11 and Tensor G6, as indicated by early internal testing and a leaked command line screenshot.
– The MediaTek M90 modem offers 12Gbps peak downlink, dual 5G SIM support, AI-enhanced power efficiency, and satellite connectivity, as announced at MWC 2025.
– The Pixel 9 and Pixel 10 have resolved overheating issues with the Exynos 5400(i) modem, and the M90 claims an 18% reduction in average power consumption compared to past MediaTek modems.
– The Tensor G6 is codenamed Malibu and has conflicting rumors about its manufacturing process, with earlier reports suggesting TSMC’s N3P and a later one indicating a 2nm process.
– A switch to the MediaTek modem would continue Google’s move away from Samsung’s foundry, following a previous unfulfilled rumor about using MediaTek for the Pixel 10 series.
Speculation is already building around Google’s next flagship smartphone, the Pixel 11, with fresh leaks suggesting a significant shift in its connectivity hardware. The upcoming device, powered by the Tensor G6 chipset, may reportedly abandon Samsung’s Exynos modems in favor of a MediaTek solution, marking a notable departure from recent Pixel tradition.
Industry insider Mystic Leaks claims Google has initiated preliminary internal testing of the MediaTek M90 modem for integration with the Pixel 11 platform. Supporting evidence includes a command line screenshot displaying a baseband version identified as “a900a,” while the bootloader carries the codename “spacecraft”, a clear evolution from the Pixel 10’s “deepspace” identifier.
This potential modem transition has been a topic of discussion before. A late 2024 rumor predicted MediaTek hardware would debut in the Pixel 10 series, though Google ultimately retained Samsung’s Exynos 5400i modem for those devices. Should the current reports prove accurate, the Pixel 11 would represent Google’s first major implementation of a MediaTek cellular modem.
MediaTek officially unveiled the M90 5G Modem at MWC in February 2025. The component promises impressive technical capabilities, including peak downlink speeds reaching 12Gbps and dual 5G SIM dual-active support with dual data capabilities. The manufacturer emphasizes integrated AI models engineered to boost power efficiency and overall device performance. Additionally, the modem supports satellite connectivity, a feature increasingly expected in premium smartphones like the Pixel flagship line. While MediaTek did not specify the manufacturing process node, the outgoing Exynos 5400i utilizes a 4nm process. Engineering samples for the M90 were scheduled to become available in the second half of 2025.
Performance and thermal management have been persistent challenges for previous Pixel modems. The Exynos 5400(i) modems in the Pixel 9 and 10 largely resolved the overheating problems that plagued earlier generations. MediaTek claims the M90 achieves an 18% reduction in average power consumption compared to its previous modem solutions, potentially offering battery life and thermal advantages. A switch to MediaTek would also underscore Google’s broader strategic shift away from Samsung’s semiconductor manufacturing for key components.
Separately, the Tensor G6 system-on-chip itself continues to be referenced under the internal codename “Malibu.” Leaked internal documents from Google’s gChips division in October 2024 outlined development progress for both the Tensor G5 and G6. Initial information indicated the Tensor G6 would utilize TSMC’s N3P (3nm) fabrication process with a 1+6 core configuration. However, a more recent rumor from June suggests Google might instead opt for TSMC’s more advanced 2nm process node, which could deliver further gains in performance and efficiency.
(Source: 9to5 Google )
