geCKo Materials Unveils 4 New Products at TechCrunch Disrupt
▼ Summary
– geCKo Materials debuted four new applications for its dry adhesive technology at TechCrunch Disrupt, including tools for semiconductor handling and robotic gripping.
– The adhesive is inspired by gecko feet, functions without residue or power, and can hold significant weight while being reusable thousands of times.
– Major customers like Ford, NASA, and PG&E adopted the technology even before the company’s 2023 competition appearance.
– The company has tripled its team size, raised $8 million, and its adhesive was used in six space missions, proving effectiveness in vacuums.
– geCKo demonstrated its adhesive moving semiconductor wafers at 5.4Gs of acceleration, exceeding industry targets and outperforming current vacuum tech.
At TechCrunch Disrupt, geCKo Materials showcased four groundbreaking applications for its advanced dry adhesive technology, signaling a major expansion into commercial markets. The company, which earned runner-up status in last year’s Startup Battlefield, returned with a compelling demonstration of how its bio-inspired adhesive is reshaping industrial automation and materials handling.
Founder Dr. Capella Kerst introduced the new offerings: a semiconductor wafer handling tool, a robotic gripper designed for smooth surfaces such as solar panels and glass, a curved robotic end effector for irregularly shaped items, and a versatile all-purpose gripper for robotic arms. Each product leverages the unique properties of geCKo’s adhesive, which mimics the gripping ability of gecko feet. Kerst likened the technology to a next-generation Velcro, one that leaves no sticky residue, attaches and releases instantly, and operates without electricity or suction. A single one-inch tile can support up to 16 pounds and withstand more than 120,000 attachment cycles, with adhesion lasting anywhere from seconds to years.
This adaptability has already attracted major industry players. Even before last year’s competition, geCKo secured partnerships with Ford, NASA, and Pacific Gas & Electric. Speaking from the stage, Kerst reflected on the company’s rapid growth, noting that her team has tripled in size and recently closed an $8 million funding round. She also highlighted that the adhesive has been deployed in six separate space missions over the past year, proving its reliability in extreme environments, including vacuums.
During the live presentation, Kerst demonstrated a Fanuc robotic arm equipped with six geCKo adhesive tiles, swiftly picking up and repositioning objects. Video footage illustrated real-world use cases, including one where the material moved semiconductor wafers far more rapidly than traditional suction or vacuum systems. Kerst shared feedback from clients like TSMC, Samsung, Intel, and Kawasaki, who challenged the company to achieve 2Gs of acceleration. In response, geCKo’s adhesive repeatedly and reliably reached an impressive 5.4Gs, exceeding expectations and demonstrating its potential to revolutionize high-speed manufacturing processes.
(Source: TechCrunch)