Longsys’ 2mm MicroSSD Breaks Speed Records
▼ Summary
– Longsys has introduced the industry’s first integrated-packaging microSSD (mSSD) measuring 20x30mm and 2mm thick, weighing just 2.2 grams.
– The mSSD achieves high performance with sequential read speeds up to 7400MB/s and write speeds up to 6500MB/s, matching larger M.2 drives.
– It uses wafer-level System-in-Package technology to integrate components, eliminating nearly 1,000 solder joints and reducing defect rates from 1,000 to 100 DPPM.
– Manufacturing efficiency is improved by removing stages like PCB placement, doubling delivery speed and cutting production costs by over 10%.
– The mSSD supports capacities from 512GB to 4TB and includes a modular heatsink for adaptability to various devices, though it may be costlier than traditional SSDs.
Longsys has launched a groundbreaking integrated-packaging microSSD (mSSD) that sets new benchmarks for storage technology. This innovative device combines multiple essential components into a single, highly compact unit, delivering exceptional performance in an impressively small form factor. Measuring just 20 x 30mm with a thickness of only 2mm, the mSSD weighs a mere 2.2 grams yet supports PCIe Gen4x4 speeds. It achieves sequential read rates of up to 7400MB/s and write speeds reaching 6500MB/s, rivaling the performance of much larger M.2 drives.
The mSSD’s design leverages wafer-level System-in-Package (SiP) technology, integrating the controller, NAND flash memory, power management IC, and passive components within one enclosure. This approach eliminates close to 1,000 solder joints typically required in conventional PCB-based SSDs. By doing so, Longsys has significantly enhanced reliability, reducing the defect rate from 1,000 defective parts per million (DPPM) to just 100 DPPM.
Manufacturing efficiency sees a major boost as well. The streamlined process removes several stages, including PCB placement and reflow soldering, which lowers complexity and minimizes risks like solder mask contamination or thermal damage. Longsys can now complete the entire manufacturing sequence, from wafer to finished product, in a single integrated procedure. This innovation not only doubles delivery efficiency but also cuts additional production costs by more than 10%.
Energy consumption is another area of improvement. By eliminating the high-energy surface-mount process, the mSSD helps reduce carbon emissions and supports compliance with environmental standards. For thermal management, Longsys employs a combination of aluminum alloy brackets, graphene patches, and thermally conductive silicone to effectively dissipate heat. The device adheres to NVMe power standards, with idle power consumption below 3.5 milliwatts and peak usage staying within specified limits.
Available in capacities ranging from 512GB to 4TB, the mSSD supports both TLC and QLC NAND types. It also features a modular clip-on heatsink that allows the form factor to be extended to M.2 2230, 2242, or 2280 standards without requiring tools. This adaptability makes it suitable for a wide array of applications, including business laptops, handheld gaming consoles, drones, and virtual reality headsets.
Currently in the ramp-up phase for mass production, the mSSD has patents filed both domestically and internationally. While its compact size and integrated design are likely to attract manufacturers, the advanced packaging technology may result in a higher initial cost compared to traditional portable SSDs.
(Source: techradar)
